When the spindle and knife ring are repaired and adjusted, if the chip edge collapse occurs in the later stage of slicing, it is likely to be caused by the factors of the circular blade. Through the above analysis, we can see that the vibration of the chip and the edge collapse are caused by the vibration of the circular blade and the existence of internal friction during slicing. At this time, the method of re tensioning the knife can be used to adjust the coaxiality of the blade edge, or the method of trimming the knife can be used to eliminate the occurrence of wafer edge collapse.
Flyer phenomenon refers to the phenomenon that wafers will take off in the process of wafer cutting. This phenomenon is particularly easy to occur when the sheet and wafer are cut to the graphite support plate. This is because the friction between the blade and the wafer is too large for the graphite support plate to bear, resulting in the phenomenon that the wafer is taken away by the blade., From the above analysis, it can be seen that there is cutting fluid between the blade and the wafer of the slitter blade, and the blade has the effect of friction on the wafer. The magnitude of friction is directly proportional to the cutting area and the cutting fluid flow. Therefore, the method of reducing the cutting fluid flow can effectively solve the flyer phenomenon.
From the actual operation, we found that when the cutting fluid drops at the cutting edge of the cutting wafer, it will also easily take off the flake. This is because the friction increases due to the excessive flow of cutting fluid, resulting in the phenomenon of flying flake. Therefore, the cutting fluid flow should not be too large, which can meet the cooling and lubrication flow at the cutting edge during cutting.